Siemens Introduces Hybrid AI Approach to Enhance Semiconductor Design with Unified Interface

A big topic at this year’s Hot Chips conference was how to use AI in semiconductor chip development. Some experts suggested integrating AI directly into electronic design automation (EDA) tools. Others thought it might be better to have AI agents work alongside these standard tools. But there was a common concern: many still feel uneasy about letting AI design crucial electronic systems. Even the top semiconductor companies are cautious about using AI in their design processes.

Now, Siemens is stepping in with a new idea. They propose a hybrid approach—a unified user interface (UI) that includes automated AI functions. This aims to boost productivity and make the design process smoother.

As the costs and complexities of semiconductors and electronic systems have risen over the past fifty years, EDA tools have become essential. These tools help ensure that designs are functional and manufacturable before they go into production, which can save a lot of money by avoiding costly redesigns. Everything from chips to printed circuit boards (PCBs) relies on these tools for simulation, analysis, and design. However, many of these tools were created with specific tasks in mind and by different companies. Right now, the main players in the EDA market are Cadence, Siemens EDA, and Synopsys.

These companies have expanded their product lines through various acquisitions. For example, Synopsys is currently acquiring Ansys, while Siemens bought Mentor Graphics back in 2017 to combine semiconductor EDA tools with multiphysics solutions. Mentor Graphics, in turn, had acquired fifteen companies. Sometimes, these acquisitions lead to tools that don’t share the same user interface, even if they’re meant to work together. This can make learning harder, slow down design cycles, and reduce productivity, even among tools from the same company.

To tackle these issues, Siemens has recently launched a series of tools for PCB design and analysis. This is a step toward creating a more consistent user experience through a common UI. Their latest offerings include Xpedition, Hyperlynx, and PADS Professional. While these tools are quite complex, here’s a quick overview: Xpedition is used for PCB design, verification, and manufacturing. Hyperlynx focuses on analyzing and simulating PCBs. PADS Professional is a comprehensive EDA suite designed for small teams working on complete electronic systems. The goal of the common UI is to make it more intuitive for users while enhancing connectivity and data security between the tools, plus enabling cloud collaboration.

Within this new UI, Siemens has integrated AI to handle routine tasks and provide engineering support. This includes features like process prediction, an in-tool product support assistant, natural language queries for datasheets, support center searches, and optimized simulations. It’s important to clarify that this is traditional AI, not generative AI. The results are based on set outcomes, not predictive guesses. This helps ease concerns about using AI in electronic system design while still boosting engineering productivity and speeding up time to market.

Siemens also highlighted that this approach could help address another pressing issue in the electronics industry: the shortage of skilled labor. As the demand for skilled talent rises in the AI era, this could be a significant advantage.

The new tools also feature better integration with Siemens’ Teamcenter product lifecycle management system and their NX mechanical design and manufacturing software. More importantly, these announcements show Siemens' commitment to creating consistency across its tools and potentially those from other vendors. While there are still worries about AI, especially generative AI, in electronic system design, Siemens’ approach demonstrates that AI can bring clear benefits. This could inspire a trend among EDA tool manufacturers to adopt similar improvements.